Role Description Responsable de diseñar y contribuir en la definición, control operativo y ejecución de los trabajos y actividades de exploración de los proyectos en todas las etapas del pipeline; contribuyendo además a identificar y evaluar nuevos oportunidades de exploración así como generando nuevos proyectos; asegurando el cumplimiento de los estándares de seguridad, medio ambiente, relaciones comunitarias y gobernanza; con el fin de contribuir en el logro de descubrimientos de depósitos de oro, cobre, oro-cobre que sean viables económicamente y tengan un impacto significativo en el crecimiento de la Compañía. Te invitamos a postular con tu curriculum actualizado adjunto. Qualifications - Experiencia en diseño y ejecución de proyectos de exploración. - Conocimiento en estándares de seguridad y medio ambiente. - Habilidades en evaluación de oportunidades de exploración. Requirements - Capacidad para trabajar en todas las etapas del pipeline de proyectos. - Experiencia en relaciones comunitarias y gobernanza. - Enfoque en descubrimientos viables económicamente. Benefits - Oportunidades de desarrollo profesional. - Compromiso con la sustentabilidad y responsabilidad social. Company Description Nuestra misión es ser la empresa de minería de oro y cobre más valiosa del mundo. Estamos comprometidos a establecer alianza con nuestros países anfitriones y comunidades para transformar sus recursos naturales en beneficios tangibles y prosperidad mutua. - Con minas y proyectos en operación en 18 países. - Fuerza laboral altamente diversificada proveniente de naciones anfitrionas. - Establecemos el estándar de oro en sustentabilidad. - Las acciones de la empresa cotizan en la Bolsa de Valores de Nueva York con el símbolo GOLD y en la Bolsa de Valores de Toronto con el símbolo ABX. - Obtenga más información en www.barrick.com o síganos en LinkedIn .

• Own end-to-end deployment of customer solutions. From initial problem framing through production implementation, you are accountable for delivering working systems on target hardware. • Work directly with customer engineers and stakeholders. Understand algorithmic requirements, system constraints, and success criteria, and translate them into actionable technical solutions. • Translate algorithms into optimized implementations. Take DSP, RF, communications, or other compute-heavy pipelines and deploy them efficiently onto GPUs, FPGAs, and other accelerators using Code Metal’s platform. • Optimize performance under real-world constraints. Profile, debug, and tune systems for latency, throughput, memory, and power across heterogeneous compute environments. • Debug across the full stack. Identify and resolve issues spanning algorithms, software, hardware, and toolchains in complex deployment environments. • Collaborate cross-functionally. Partner with product and engineering teams to improve the platform based on field learnings and unblock customer deployments. • Operate with a “whatever it takes” mindset. Navigate ambiguity, unblock critical issues, and do what is required to move deployments forward in high-stakes environments. • Build reusable patterns and playbooks. Capture learnings from deployments to improve repeatability and scale across customers. • Support on-site deployments. Travel as needed (30-75% depending on the customer) to integrate, test, and validate systems in real-world environments.

Role Description As a Senior Integration Engineer, you will design, build, and support APIs and integration workflows that connect internal applications, vendor platforms, digital banking solutions, and lending systems. This role is a hands-on senior individual contributor position focused on delivering secure, scalable and maintainable system integrations in a regulated financial services environment. What You’ll Be Doing - Design, develop, and support APIs and system integrations across internal applications and third-party vendor platforms. - Build and maintain backend services and integration workflows using .NET/C# and Microsoft technologies. - Develop and support RESTful APIs following best practices for scalability, security, and maintainability. - Orchestrate multi-system workflows using FlowGear or similar integration platforms. - Partner with business, product, and technical teams to translate requirements into practical integration solutions. - Troubleshoot and resolve integration issues across applications, data flows, and vendors. - Contribute to documentation, testing, observability, and integration standards. - Support onboarding and integration of new third-party platforms and services. - Collaborate within an Agile delivery model and contribute to continuous improvement initiatives. Qualifications - Bachelor’s degree in Computer Science, Information Systems, Engineering, or equivalent practical experience. - 5+ years of software engineering experience with a strong focus on integrations and API development. - Strong hands-on experience with .NET / C#. - Experience designing and supporting REST APIs and system-to-system integrations. - Experience with an integration middleware or iPaaS platform (FlowGear, MuleSoft, Boomi, Azure Logic Apps, or similar). - Working knowledge of Azure services supporting application and integration workloads. - Understanding of integration security concepts including OAuth, TLS/SSL, and secure data exchange. - Strong troubleshooting, communication, and collaboration skills. - Preferred experience in banking, credit union, digital banking, or lending environments. - Familiarity with Jack Henry Symitar or similar core banking systems is a plus. Requirements - Stable internet connection with speeds high enough for video conferencing and screen sharing. - Smartphone with current iOS/Android OS. - Prolonged periods sitting at a workstation and working on a computer. - Ability to communicate with coworkers and customers via email, chat, teleconference, and/or phone. Compensation & Rewards - Compensation for this role is $110,400 - $135,400 per year with the potential for discretionary incentive compensation based on both company and individual performance. Benefits - Excellent health insurance packages with a Health Reimbursement Account option. - Life, AD&D, Short-Term Disability and Travel Insurance. - 401k plan with company match dollar for dollar up to 6 percent* - Generous time-off policy with paid time off (PTO), volunteer time off (VTO), birthday PTO, and company-observed holidays. - Monthly stipend for wellness activities and mental health* - Tuition reimbursement. - Pet Benefits, including insurance, discounts, “pawternity” PTO day, and more. - Bonus/commission plan for qualifying roles. - Employee perks (including mortgage discounts!). - PTO purchase and sell-back programs. - Rewards and peer recognition programs. - Trust-based, outcome-oriented remote work environment for most roles. Important Compliance Information - Quorum is an Equal Employment Opportunity employer. Qualified applicants will be considered for employment without regard to race, color, religion, gender, sexual orientation, national origin, age, marital status, protected veteran status, or disability status. - Quorum will make reasonable accommodations in compliance with the Americans with Disabilities Act of 1990. Reasonable accommodations are available upon request for applicants and/or employees with qualifying disabilities throughout the application and employment process. - Qualified Applicants with arrest or conviction records will be considered for employment in accordance with all applicable federal, state, city and local laws, rules, and regulations. - This job description in no way states or implies that these are the only duties to be performed by the employee(s) incumbent in this position. Employee(s) will be required to follow any other job-related instructions and to perform any other job-related duties requested by any person authorized to give instructions or assignments. - The company reserves the sole right and discretion to make changes to this job description. - Each employee is required to uphold the Credit Union's compliance with all policies, procedures, and required regulations including the Bank Secrecy Act and our Anti-Money Laundering policy. - This document does not create an employment contract, implied or otherwise, other than an "at-will" relationship.

Role Description This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches. Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform. This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology. Responsibilities - Substrate & Interposer Design - Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements. - Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk. - Ensure robust signal integrity (SI) and power integrity (PI) across all designs. - Optimize designs for thermal performance and reliability. - Design Validation & Documentation - Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs. - Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development. - Cross-Functional Collaboration - Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance. - Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints. - Technical Leadership & Development - Contribute to the establishment of internal best practices for substrate and interposer design. - Provide expertise in advanced packaging design, helping build this capability within Syenta. Qualifications - Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. - 5+ years of experience in substrate IC package design for high-performance processors or accelerators. - Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts. - Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches. - Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification). - Strong understanding of SI/PI principles and their application to package-level design. - Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines. - Working knowledge of substrate manufacturing processes, design rules, and material properties. - Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment. Preferred Qualifications - Familiarity with Valor CAM350 or Calibre for package design reviews. - Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems). - Experience working in high-growth or startup environments. Benefits - Salary Range: $130,000 – $180,000 + ESOP. - Hybrid work environment (Sydney-based). - Flexible leave policies and strong work-life balance. - Opportunity to work closely with leadership and shape company direction. - Professional growth in a high-impact, fast-growing deep-tech startup.