Syenta

Role Description This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches. Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform. This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology. Responsibilities - Substrate & Interposer Design - Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements. - Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk. - Ensure robust signal integrity (SI) and power integrity (PI) across all designs. - Optimize designs for thermal performance and reliability. - Design Validation & Documentation - Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs. - Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development. - Cross-Functional Collaboration - Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance. - Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints. - Technical Leadership & Development - Contribute to the establishment of internal best practices for substrate and interposer design. - Provide expertise in advanced packaging design, helping build this capability within Syenta. Qualifications - Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. - 5+ years of experience in substrate IC package design for high-performance processors or accelerators. - Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts. - Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches. - Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification). - Strong understanding of SI/PI principles and their application to package-level design. - Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines. - Working knowledge of substrate manufacturing processes, design rules, and material properties. - Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment. Preferred Qualifications - Familiarity with Valor CAM350 or Calibre for package design reviews. - Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems). - Experience working in high-growth or startup environments. Benefits - Salary Range: $130,000 – $180,000 + ESOP. - Hybrid work environment (Sydney-based). - Flexible leave policies and strong work-life balance. - Opportunity to work closely with leadership and shape company direction. - Professional growth in a high-impact, fast-growing deep-tech startup.

This description is a summary of our understanding of the job description. Click on 'Apply' button to find out more. Role Description Syenta is seeking an experienced and motivated Senior Grant Specialist to lead execution of our government funding strategy. Your work will be instrumental in identifying, securing, and managing federal and state grant opportunities especially through agencies such as the CHIPS, DOE, DOD and ARPA-E. You will collaborate across teams to craft compelling proposals that align with national priorities in semiconductors, advanced manufacturing, critical materials, and supply chain resilience. Your work will directly accelerate Syenta’s mission and bring groundbreaking technologies to scale. - Identify and pursue non-dilutive funding opportunities that align with Syenta’s mission and R&D roadmap - Lead the development, writing, and submission of high-quality and compelling grant proposals to agencies including CHIPS, DOE, DOD, ARPA-E, and others - Lead the preparation, submission and management of grant applications, ensuring compliance with all technical and administrative requirements - Maintain a detailed knowledge of emerging semi-conductor technologies, AI hardware trends, Localized Electrochemical Manufacturing (LEM) and relevant funding programs - Collaborate with engineering, R&D, and leadership teams to gather technical content and build strategic narratives - Take ownership over generating technical proposals and whitepapers - Track and maintain reporting requirements, deliverables, and milestone compliance for awarded grants - Monitor policy and program updates to proactively align Syenta with emerging funding priorities - Cultivate relationships with government program managers and consortium partners to increase funding success - Provide internal reporting and analysis on funding performance and strategic opportunities Qualifications - 5+ years of experience writing, winning, and managing federal and/or state grant proposals, ideally in semiconductors, defense, or advanced manufacturing - Bachelor’s degree in Science, Engineering, Physics, or other technically related field - Demonstrated success securing funding from US government agencies - Strong technical writing skills with the ability to distil complex ideas into compelling and compliant narratives - Knowledge of federal grant processes, budgeting, compliance, and reporting requirements - Experience collaborating with cross-functional technical teams and external stakeholders - Highly organized, detail-oriented, and proactive in tracking and managing deadlines and deliverables - Passion for driving innovation through public-private partnership Benefits - Equity Opportunities – We’re happy to discuss ownership stakes so that our success becomes your success - Potential 401(k) and other benefits - Health & Wellness – Employee led comprehensive health, dental, and vision coverage plans, supported by Company - Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business - Team Events – Annual company event in Australia to collaborate and celebrate - Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life - Initial Paid Time Off Package – 20 days vacation + 10 days sick leave