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Director of System Hardware Engineering

Hardware EngineerHardware EngineerOtherRemoteLeadTeam 11-50H1B No SponsorCompany SiteLinkedIn

Location

United States

Posted

71 days ago

Salary

0

Seniority

Lead

Bachelor Degree10 yrs expEnglishPython

Job Description

Director of System Hardware Engineering

Delos Data

• Define the technical roadmap for server hardware platforms and advanced package technologies (e.g., 2.5D/3D IC, chiplets, system-in-package). • Oversee end-to-end system design, including high-speed board-level hardware, ASIC packaging, SI/PI simulations, and PCB layout. • Lead and mentor a multidisciplinary team of electrical, mechanical, and package engineers. • Partner with silicon design, firmware, software, and manufacturing teams to ensure integration and manufacturability (DFM/DFT). • Interface with OSAT and ODM partners to drive packaging technologies, prototype builds, and manufacturing quality. • Guide system bring-up, validation, and debug, including thermal and power management. • Own the full hardware lifecycle from concept through volume production, including schedules and budgets.

Job Requirements

  • BS, MS, or PhD in Electrical Engineering, Computer Engineering, or Materials Science.
  • 10+ years of experience in hardware system design, including at least 5+ years in a technical leadership or management role.
  • Deep expertise in server architecture, data center hardware, and high-speed interfaces (PCIe Gen5/6, DDR5/6, CXL).
  • Strong knowledge of advanced chip packaging techniques such as chiplets, interposers, and flip-chip BGA.
  • Proficiency with simulation tools (ANSYS HFSS/SIwave, Cadence Sigrity, Mentor Graphics) and PCB CAD tools (Allegro or similar).
  • Demonstrated experience leading multidisciplinary teams and delivering complex, high-volume hardware products.
  • Excellent verbal and written communication skills.
  • Experience with advanced cooling solutions (liquid cooling, vapor chambers) for high-TDP servers.
  • Knowledge of scripting languages for automation (Python, Tcl).
  • Record of patents or technical publications in semiconductor packaging.

Benefits

  • This position will require moderate travel to meet with team members and visit partners and suppliers, including ODMs in Asia.
  • We do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired.

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