• Prototyping, integration, and development of drivers and components in embedded C for customer audio projects (TWS Earbuds, Headsets, Speakers) according to the product requirements based on the various SoCs, primarily focused on Qualcomm platforms, specifically the new S7 platform • Hardware/SW configurations and measurements during prototyping and pre-production • Developing unit and integration tests to verify software integrity using analysis tools to check for potential issues in our codebase

This description is a summary of our understanding of the job description. Click on 'Apply' button to find out more. Role Description - Develop test plans, writing testbenches and tests, and debugging any bugs found with the RTL team - Develop and execute verification plans for digital designs using SystemVerilog and UVM - Create and maintain testbenches, test cases, and test vectors - Contribute to the development of novel methodologies and verification techniques - Lead technical projects and mentorship of junior team members - Run simulations to verify design against specifications. Analyze results, identify issues, and debug designs - Implement coverage tracking and metrics - Document plans, environments, test cases, and all results for a comprehensive record of all verification strategies Qualifications - BSEE/MSEE with 15+ years of hands-on experience in SoC verification using UVM - Experience in Gate Level Simulation (GLS) setup and process corner failure analysis - Experience using Cadence verification tools such as Xcelium, SimVision, and JasperGold - Experience writing and debugging RTL using SystemVerilog - Programming experience using C, C++, and/or Python/Perl - Familiarity with digital design concepts and ASIC development flow Requirements - Experience verifying RISC-V based systems - Experience with emulation or FPGA prototyping - Experience with formal verification methodologies - Familiarity with the Chisel hardware description language - Experience verifying high-speed interfaces such as PCIe and DDR - Experience with version control systems (e.g., Git) and Continuous Integration/Continuous Deployment (CI/CD) pipelines Benefits - Competitive salary scaled based on experience - Bonus - Stock - Employer paid health care - Employer contribution to health savings account - Flexible time off - Flexible work location with remote options - 401K employer match

This description is a summary of our understanding of the job description. Click on 'Apply' button to find out more. Role Description - Assist with silicon bring-up - Contribute to all areas of SoC design, verification, and implementation - Design, implement and integrate complex SoC blocks - Develop block-level test cases to deliver fully functional designs - Develop micro-architecture specifications based on the SoC requirements - Develop synthesis constraints and resolve timing issues - Identify and resolve RTL and Gate-Level Simulation (GLS) failures at block and chip level - Participate in architectural feasibility studies - Participate in ECO implementation - Projects range from integrating third party IPs to designing complex systems - Resolve Lint, CDC, and DFT related issues Qualifications - BSEE/MSEE with 15+ years of SoC design/architecture experience - Clock domain crossing methodologies - Experience with RISC-V architecture - Logic synthesis and static timing analysis - Modeling SoC architectures with FPGAs - RTL Design including HVLs and HDLs (SystemVerilog, Verilog) - Scripting languages such as Python, Perl, Tcl, shell, etc. - SoC design flow including chip-level design, block/IP design and behavioral modeling - Strong familiarity with EDA tools - Strong problem solving and debugging capabilities - Third Party IP Integration experience - Working knowledge of PCIe and DDR - Working knowledge of standard bus protocols such as AXI/AMBA/TileLink - Working knowledge of SoC design with Chisel (plus) - Asynchronous logic design (plus) Benefits - Competitive salary scaled based on experience - Bonus - Stock - Employer paid health care - Employer contribution to health savings account - Flexible time off - Flexible work location with remote options - 401K employer match

Date Posted: 2026-03-10Country: United States of AmericaLocation: US-CA-REMOTEPosition Role Type: RemoteU.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.Security Clearance Type: None/Not RequiredSecurity Clearance Status: Not Required At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon Space & Airborne Mechanical Systems is currently seeking a Senior Electro-Mechanical Engineer for the Advanced Microelectronics Packaging and Design organization in El Segundo, CA to develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies across Raytheon. This position offers the opportunity for remote work. What You Will Do: - Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products. - Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products. - Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met. - Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials. Qualifications You Must Have: Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) degree and a minimum of 5 years’ prior relevant experience, to include any combination of the following: - Experience in circuit layout design using 2D CAD tools - Experience performing mechanical and electrical engineering design - Experience with semiconductor manufacturing processes and materials - Experience with high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping - Experience with electronic components / devices such as ASICs and FPGAs - Experience with the design of electronic packaging chassis and structures, interconnects (connectors/cables), and / or thermal management design of high-density electronic systems and electronic enclosures Qualifications We Prefer: - RF circuit design, including 3D EM simulation in HFSS or similar tools - Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+) - Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing) - Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design - Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging - Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products - Experience with designing electronics for extreme environmental requirements and design constraints - Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo). - Experience in Geometric Dimensioning and Tolerance analysis for drawings - Possess an active security clearance What We Offer Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation. This position offers relocation based on candidate eligibility. Learn More & Apply Now! This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote. The salary range for this role is 86,800 USD - 165,200 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate’s work experience, location, education/training, and key skills. Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement. Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company’s performance. This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply. RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window. RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act. Privacy Policy and Terms: Click on this link to read the Policy and Terms