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Encore Semi logo
Encore Semi

Based in San Diego, California, Encore Semi is a privately-held semiconductors and engineering services company that specializes in building expert teams, or Centers of Expertise,

Sr ASIC Packaging Engineer

Location

United States

Posted

87 days ago

Salary

0

No structured requirement data.

Job Description

Sr ASIC Packaging Engineer

Encore Semi

This description is a summary of our understanding of the job description. Click on 'Apply' button to find out more. Role Description We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing. - EM & Signal Integrity: Lead full-wave 3D electromagnetic simulations using ANSYS HFSS for ASIC package extractions. Optimize bump-to-ball transitions and high-speed SerDes paths using Agilent ADS. - Package Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out Wafer-Level Packaging (FOWLP). - Integration & Test (I&T): Drive the Integration and Test phase by correlating simulation models with physical hardware measurements (VNA/TDR). Validate package-level power delivery networks (PDN). - Prototyping & Additive: Utilize Additive Manufacturing to develop custom heat sinks, interposers, or rapid-prototype substrates, reducing the R&D cycle for complex ASIC form factors. Qualifications - 10+ years in Electronics Packaging, specifically focused on high-bump-count ASICs and high-speed interfaces. - Expert proficiency in ANSYS HFSS and Agilent ADS for package-level SI/PI analysis. - Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry. - B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science. Requirements The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package. Benefits - 15 days of PTO per calendar year - 10 paid Holidays per calendar year - Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents - Dental & Vision: Company covers 50% of premiums for Employee and Dependents - Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance - Employee Assistant Program (EAP) - 401k - Traditional & Roth - Life/AD&D and Long-Term Disability - Tuition reimbursement

Job Requirements

  • 10+ years in Electronics Packaging, specifically focused on high-bump-count ASICs and high-speed interfaces.
  • Expert proficiency in ANSYS HFSS and Agilent ADS for package-level SI/PI analysis.
  • Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.
  • B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.
  • The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package.

Benefits

  • 15 days of PTO per calendar year
  • 10 paid Holidays per calendar year
  • Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
  • Dental & Vision: Company covers 50% of premiums for Employee and Dependents
  • Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
  • Employee Assistant Program (EAP)
  • 401k - Traditional & Roth
  • Life/AD&D and Long-Term Disability
  • Tuition reimbursement

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